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 FemtoClockTM Crystal-to-3.3V LVPECL Frequency Synthesizer
ICS843004-125
ADVANCE INFORMATION
DATA SHEET
GENERAL DESCRIPTION
The ICS843004-125 is a 4 output LVPECL SynIC S thesizer optimized to generate Ethernet reference HiPerClockSTM clock frequencies and is a member of the HiPerClocks TM family of high performance clock solutions from IDT. The ICS843004-125 uses IDT's 3rd generation low phase noise VCO technology and can achieve 1ps or lower typical rms phase jitter, easily meeting Ethernet jitter requirements. The ICS843004-125 is packaged in a small 24-pin TSSOP package.
FEATURES
* Four 3.3V LVPECL output pairs * Selectable crystal oscillator interface or LVCMOS/LVTTL single-ended input * Crystal oscillator designed for 25MHz, 18pF parallel resonant crystal * Supports the following output frequency: 125MHz * VCO range: 560MHz - 680MHz * RMS phase jitter @ 125MHz, using a 25MHz crystal (1.875MHz - 20MHz): 0.58ps (typical) * Full 3.3V supply mode * 0C to 70C ambient operating temperature * Available in lead-free (RoHS 6) package
FREQUENCY SELECT FUNCTION TABLE
Inputs M Divider Value 25 N Divider Value 5 M/N Divider Value 5 Output Frequency (MHz) (25MHz Ref.) 125
BLOCK DIAGRAM
Q0 nPLL_SEL Pulldown nQ0 Q1 REF_CLK Pulldown
25MHz
PIN ASSIGNMENT
nQ1 Q1 VCCo Q0 nQ0 MR nPLL_SEL nc VCCA nc VCC nc 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 nQ2 Q2 VCCO Q3 nQ3 VEE VCC nXTAL_SEL REF_CLK VEE XTAL_IN XTAL_OUT
1
1
nQ1
XTAL_IN
OSC
XTAL_OUT nXTAL_SEL Pulldown
0
Phase Detector
VCO 625MHz (w/25MHz Reference)
/5
0 Q2 nQ2 Q3
M = 25 (fixed)
nQ3
ICS843004-125
24-Lead TSSOP 4.40mm x 7.8mm x 0.925mm package body G Package Top View
MR Pulldown
ICS843004AG-125 REVISION A JUNE 3, 2009
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(c)2009 Integrated Device Technology, Inc.
ICS43004-125 Data Sheet
FEMTOCLOCKTM CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
TABLE 1. PIN DESCRIPTIONS
Number 1, 2 3, 22 4, 5 6 Name nQ1, Q1 VCCO Q0, nQ0 MR Type Output Power Ouput Input Description Differential output pair. LVPECL interface levels. Output supply pins. Differential output pair. LVPECL interface levels. Active HIGH Master Reset. When logic HIGH, the internal dividers are reset causing the true outputs Qx to go low and the inver ted outputs nQx to go high. When logic Pulldown LOW, the internal dividers and the outputs are enabled. LVCMOS/LVTTL interface levels. Selects between the PLL and REF_CLK as input to the dividers. When LOW, selects Pulldown PLL (PLL Enable). When HIGH, deselects the reference clock (PLL Bypass). LVCMOS/LVTTL interface levels. No connect. Analog supply pin. Core supply pins. Parallel resonant cr ystal interface. XTAL_OUT is the output, XTAL_IN is the input. Negative supply pins. Pulldown Single-ended reference clock input. LVCMOS/LVTTL interface levels. Selects between cr ystal or REF_CLK inputs as the the PLL Reference source. Pulldown Selects XTAL inputs when LOW. Selects REF_CLK when HIGH. LVCMOS/LVTTL interface levels. Differential output pair. LVPECL interface levels. Differential output pair. LVPECL interface levels.
7 8, 10, 12 9 11, 18 13, 14 15, 19 16 17 20, 21 23, 24
nPLL_SEL nc VCCA VCC XTAL_OUT, XTAL_IN VEE REF_CLK nXTAL_SEL nQ3, Q3 Q2, nQ2
Input Unused Power Power Input Power Input Input Output Output
NOTE: Pulldown refers to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol CIN RPULLDOWN Parameter Input Capacitance Input Pulldown Resistor Test Conditions Minimum Typical 4 51 Maximum Units pF k
ICS843004AG-125 REVISION A JUNE 3, 2009
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(c)2009 Integrated Device Technology, Inc.
ICS43004-125 Data Sheet
FEMTOCLOCKTM CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VCC Inputs, VI Outputs, IO Continuous Current Surge Current Storage Temperature, TSTG 4.6V -0.5V to VCC + 0.5V 50mA 100mA -65C to 150C NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability.
Package Thermal Impedance, JA 82.3C/W (0 mps)
TABLE 3A. POWER SUPPLY DC CHARACTERISTICS, VCC = VCCO = 3.3V5%, V = 0V, TA = 0C TO 70C
EE
Symbol VCC VCCA VCCO IEE ICCA
Parameter Core Supply Voltage Analog Supply Voltage Output Supply Voltage Power Supply Current Analog Supply Current
Test Conditions
Minimum 3.135 VCC - 0.15 3.135
Typical 3.3 3.3 3.3
Maximum 3.465 VCC 3.465 130 15
Units V V V mA mA
Included in IEE
TABLE 3B. LVCMOS / LVTTL DC CHARACTERISTICS, VCC = VCCO = 3.3V5%, V = 0V, TA = 0C TO 70C
EE
Symbol VIH VIL IIH IIL
Parameter Input High Voltage Input Low Voltage Input High Current Input Low Current REF_CLK, MR, nPLL_SEL, nXTAL_SEL REF_CLK, MR, nPLL_SEL, nXTAL_SEL
Test Conditions
Minimum 2 -0.3
Typical
Maximum VCC + 0.3 0.8 150
Units V V A A
VCC = VIN = 3.465V VCC = 3.465V, VIN = 0V -5
TABLE 3C. LVPECL DC CHARACTERISTICS, VCC = VCCO = 3.3V5%, V = 0V, TA = 0C TO 70C
EE
Symbol VOH VOL VSWING
Parameter Output High Voltage; NOTE 1 Output Low Voltage; NOTE 1 Peak-to-Peak Output Voltage Swing
Test Conditions
Minimum VCCO - 1.4 VCCO - 2.0 0.6
Typical
Maximum VCCO - 0.9 VCCO - 1.7 1.0
Units V V V
NOTE 1: Outputs terminated with 50 to VCCO - 2V.
ICS843004AG-125 REVISION A JUNE 3, 2009
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(c)2009 Integrated Device Technology, Inc.
ICS43004-125 Data Sheet
FEMTOCLOCKTM CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
TABLE 4. CRYSTAL CHARACTERISTICS
Parameter Mode of Oscillation Frequency Equivalent Series Resistance (ESR) Shunt Capacitance NOTE: Characterized using an 18pF, parallel resonant crystal. Test Conditions Minimum Typical Fundamental 25 50 7 MHz pF Maximum Units
TABLE 5. AC CHARACTERISTICS, VCC = VCCO = 3.3V5%, V = 0V, TA = 0C TO 70C
EE
Symbol fOUT
Parameter Output Frequency Output Skew; NOTE 1, 2 RMS Phase Jitter; NOTE 3 Output Rise/Fall Time
Test Conditions
Minimum 112
Typical 125 0.58
Maximum 136 50
Units MHz ps ps ps
tsk(o) tjit(O)
tR / tF
125MHz (1.875MHz - 20MHz) 20% to 80% 300
600
odc Output Duty Cycle 48 52 % NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached under these conditons. NOTE 1: Defined as skew between outputs at the same supply voltages and with equal load conditions. Measured at the differential cross points. NOTE 2: This parameter is defined in accordance with JEDEC Standard 65. NOTE 3: Phase jitter is dependent on the input source used.
ICS843004AG-125 REVISION A JUNE 3, 2009
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(c)2009 Integrated Device Technology, Inc.
ICS43004-125 Data Sheet
FEMTOCLOCKTM CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
TYPICAL PHASE NOISE
AT
125MHZ
10Gb Ethernet Filter
NOISE POWER dBc Hz
125MHz
RMS Phase Jitter (Random) 1.875MHz to 20MHz = 0.58ps (typical)
Raw Phase Noise Data
OFFSET FREQUENCY (HZ)
Phase Noise Result by adding 10Gb Ethernet Filter to raw data
(c)2009 Integrated Device Technology, Inc.
ICS843004AG-125 REVISION A JUNE 3, 2009
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ICS43004-125 Data Sheet
FEMTOCLOCKTM CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
PARAMETER MEASUREMENT INFORMATION
2V 2V nQx Qx nQy
VCC, VCCO
Qx
SCOPE
VCCA
LVPECL
nQx VEE
Qy
tsk(o)
-1.3V0.165V
3.3V CORE/3.3V OUTPUT LOAD AC TEST CIRCUIT
OUTPUT SKEW
Phase Noise Plot
Noise Power
nQ0:nQ3
Phase Noise Mask
80%
80% VSW I N G
f1
Offset Frequency
f2
Q0:Q3
20% tR tF
20%
RMS Jitter = Area Under the Masked Phase Noise Plot
RMS PHASE JITTER
OUTPUT RISE/FALL TIME
nQ0:nQ3 Q0:Q3
t PW
t
PERIOD
odc =
t PW t PERIOD
x 100%
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
ICS843004AG-125 REVISION A JUNE 3, 2009
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(c)2009 Integrated Device Technology, Inc.
ICS43004-125 Data Sheet
FEMTOCLOCKTM CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
APPLICATION INFORMATION
POWER SUPPLY FILTERING TECHNIQUES
As in any high speed analog circuitry, the power supply pins are vulnerable to random noise. To achieve optimum jitter performance, power supply isolation is required. The ICS843004-125 provides separate power supplies to isolate any high switching noise from the outputs to the internal PLL. VCC, VCCA and VCCO should be individually connected to the power supply plane through vias, and 0.01F bypass capacitors should be used for each pin. Figure 1 illustrates this for a generic VCC pin and also shows that VCCA requires that an additional10 resistor along with a 10F bypass capacitor be connected to the VCCA pin.
3.3V VCC .01F VCCA .01F 10 F 10
FIGURE 1. POWER SUPPLY FILTERING
RECOMMENDATIONS FOR UNUSED INPUT AND OUTPUT PINS INPUTS:
CRYSTAL INPUTS For applications not requiring the use of the crystal oscillator input, both XTAL_IN and XTAL_OUT can be left floating. Though not required, but for additional protection, a 1kW resistor can be tied from XTAL_IN to ground. REF_CLK INPUT For applications not requiring the use of the reference clock, it can be left floating. Though not required, but for additional protection, a 1k resistor can be tied from the REF_CLK to ground. LVCMOS CONTROL PINS All control pins have internal pullups or pulldowns; additional resistance is not required but can be added for additional protection. A 1k resistor can be used.
OUTPUTS:
LVPECL OUTPUTS All unused LVPECL outputs can be left floating. We recommend that there is no trace attached. Both sides of the differential output pair should either be left floating or terminated.
CRYSTAL INPUT INTERFACE
The ICS843004-125 has been characterized with 18pF parallel resonant crystals. The capacitor values shown in Figure 2 below were determined using a 25MHz, 18pF parallel resonant crystal and were chosen to minimize the ppm error.
XTAL_OUT C1 33p X1 18pF Parallel Crystal XTAL_IN C2 27p
FIGURE 2. CRYSTAL INPUT INTERFACE
ICS843004AG-125 REVISION A JUNE 3, 2009
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(c)2009 Integrated Device Technology, Inc.
ICS43004-125 Data Sheet
FEMTOCLOCKTM CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
LVCMOS TO XTAL INTERFACE
The XTAL_IN input can accept a single-ended LVCMOS signal through an AC coupling capacitor. A general interface diagram is shown in Figure 3 The XTAL_OUT pin can be left floating. The input edge rate can be as slow as 10ns. For LVCMOS signals, it is recommended that the amplitude be reduced from full swing to half swing in order to prevent signal interference with the power rail and to reduce noise. This configuration requires that the output
VDD
impedance of the driver (Ro) plus the series resistance (Rs) equals the transmission line impedance. In addition, matched termination at the crystal input will attenuate the signal in half. This can be done in one of two ways. First, R1 and R2 in parallel should equal the transmission line impedance. For most 50 applications, R1 and R2 can be 100. This can also be accomplished by removing R1 and making R2 50.
VDD
R1 Ro Rs Zo = 50 .1uf XTAL_IN
Zo = Ro + Rs
R2
XTAL_OUT
FIGURE 3. GENERAL DIAGRAM FOR LVCMOS DRIVER TO XTAL INPUT INTERFACE
TERMINATION FOR 3.3V LVPECL OUTPUTS
The clock layout topology shown below is a typical termination for LVPECL outputs. The two different layouts mentioned are recommended only as guidelines. FOUT and nFOUT are low impedance follower outputs that generate ECL/LVPECL compatible outputs. Therefore, terminating resistors (DC current path to ground) or current sources must be used for functionality. These outputs are designed to drive 50 transmission lines. Matched impedance techniques should be used to maximize operating frequency and minimize signal distortion. Figures 4A and 4B show two different layouts which are recommended only as guidelines. Other suitable clock layouts may exist and it would be recommended that the board designers simulate to guarantee compatibility across all printed circuit and clock component process variations.
R3 125 3.3V
+
3.3V
3.3V 3.3V Zo = 50
R4 125
3.3V +
Zo = 50
_ LVPECL Zo = 50 R1 50 RTT = 1 * Zo ((VOH + VOL) / (VCC - 2)) - 2 R2 50 VCC - 2V RTT Input
_ LVPECL Zo = 50 R1 84 R2 84 Input
FIGURE 4A. LVPECL OUTPUT TERMINATION
FIGURE 4B. LVPECL OUTPUT TERMINATION
ICS843004AG-125 REVISION A JUNE 3, 2009
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(c)2009 Integrated Device Technology, Inc.
ICS43004-125 Data Sheet
FEMTOCLOCKTM CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
LAYOUT GUIDELINE
Figure 5 shows an example of ICS843004-125 application schematic. In this example, the device is operated at VCC = VCCO = 3.3V. The 18pF parallel resonant 25MHz crystal is used. The C1= 33pF and C2 = 27pF are recommended for frequency accuracy. For different board layout, the C1 and C2 may be slightly adjusted
for optimizing frequency accuracy. Two examples of LVPECL terminations are shown in this schematic. Additional termination approaches are shown in the LVPECL Termination Application Note.
MR nPLL_SEL VCC VCCA R1 10 3.3V C5 10uF C6 0.01u VCCO Zo = 50 Ohm R2 133 R3 133
Logic Control Input Examples
VDD
VCC C4 0.1uF 12 11 10 9 8 7 6 5 4 3 2 1 C3 0.1uF U1 Zo = 50 Ohm
+
Set Logic Input to '1'
RU1 1K
VDD
Set Logic Input to '0'
RU2 Not Install
-
RD1 Not Install
RD2 1K
XTAL_OUT XTAL_IN VEE REF_CLK nXTAL_SEL VCC VEE nQ3 Q3 VCCO Q2 nQ2
To Logic Input pins
To Logic Input pins
nc VCC nc VCCA nc nPLL_SEL MR nQ0 Q0 VCCO Q1 nQ1
R4 82.5
R5 82.5
VCC=3.3V VCCO=3.3V
13 14 15 16 17 18 19 20 21 22 23 24
Zo = 50 Ohm + Zo = 50 Ohm C1 33pF VCC Q1 Ro ~ 7 Ohm R9 43 Driv er_LVCMOS nXTAL_SEL Zo = 50 Ohm X1 25MHz8 p F 1 VCC VCCO VCCO C2 27pF C7 0.1uF C8 0.1uF R6 50 R7 50 -
Optional Y-Termination
R8 50
FIGURE 5. ICS843004-01 SCHEMATIC EXAMPLE
ICS843004AG-125 REVISION A JUNE 3, 2009
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(c)2009 Integrated Device Technology, Inc.
ICS43004-125 Data Sheet
FEMTOCLOCKTM CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS843004-125. Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS843004-125 is the sum of the core power plus the power dissipated in the load(s). The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results. NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
* *
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 130mA = 450.45mW Power (outputs)MAX = 30mW/Loaded Output pair If all outputs are loaded, the total power is 4 * 30mW = 120mW
Total Power_MAX (3.465V, with all outputs switching) = 450.45mW + 120mW = 570.45mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device. The maximum recommended junction temperature for HiPerClockSTM devices is 125C. The equation for Tj is as follows: Tj = JA * Pd_total + TA Tj = Junction Temperature JA = Junction-to-Ambient Thermal Resistance Pd_total = Total Device Power Dissipation (example calculation is in section 1 above) TA = Ambient Temperature In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming no air flow and a multi-layer board, the appropriate value is 82.3C/W per Table 6 below. Therefore, Tj for an ambient temperature of 70C with all outputs switching is: 70C + 0.570W * 82.3C/W = 116.9C. This is below the limit of 125C. This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow, and the type of board (multi-layer).
TABLE 6. THERMAL RESISTANCE JA FOR 24-PIN TSSOP, FORCED CONVECTION
JA by Velocity (Meters per Second)
0
Multi-Layer PCB, JEDEC Standard Test Boards 82.3C/W
1
78.0C/W
2.5
75.9C/W
ICS843004AG-125 REVISION A JUNE 3, 2009
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(c)2009 Integrated Device Technology, Inc.
ICS43004-125 Data Sheet
FEMTOCLOCKTM CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load. LVPECL output driver circuit and termination are shown in Figure 6.
VCC
Q1
VOUT RL 50 VCC - 2V
FIGURE 6. LVPECL DRIVER CIRCUIT AND TERMINATION
To calculate worst case power dissipation into the load, use the following equations which assume a 50 load, and a termination voltage of V - 2V.
CC
*
For logic high, VOUT = VOH_MAX = VCC_MAX - 0.9V (VCCO_MAX - VOH_MAX) = 0.9V
*
For logic low, VOUT = VOL_MAX = VCC_MAX - 1.7V (VCCO_MAX - VOL_MAX) = 1.7V
Pd_H is power dissipation when the output drives high. Pd_L is the power dissipation when the output drives low.
Pd_H = [(VOH_MAX - (VCC_MAX - 2V))/R ] * (VCC_MAX - VOH_MAX) = [(2V - (V
L
CC_MAX
- VOH_MAX))/R ] * (VCC_MAX - VOH_MAX) =
L
[(2V - 0.9V)/50] * 0.9V = 19.8mW Pd_L = [(VOL_MAX - (VCC_MAX - 2V))/R ] * (VCC_MAX - VOL_MAX) = [(2V - (V _MAX - VOL_MAX))/R ] * (VCC_MAX - VOL_MAX) = L CC L [(2V - 1.7V)/50] * 1.7V = 10.2mW Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW
ICS843004AG-125 REVISION A JUNE 3, 2009
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(c)2009 Integrated Device Technology, Inc.
ICS43004-125 Data Sheet
FEMTOCLOCKTM CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
RELIABILITY INFORMATION
TABLE 7. JAVS. AIR FLOW TABLE FOR 24 LEAD TSSOP
JA by Velocity (Meters per Second)
0
Multi-Layer PCB, JEDEC Standard Test Boards 82.3C/W
1
78.0C/W
2.5
75.9C/W
TRANSISTOR COUNT
The transistor count for ICS843004-125 is: 2894
PACKAGE OUTLINE
PACKAGE OUTLINE - G SUFFIX FOR 24 LEAD TSSOP
AND
DIMENSIONS
TABLE 8. PACKAGE DIMENSIONS
SYMBOL N A A1 A2 b c D E E1 e L aaa 0.45 0 -4.30 0.65 BASIC 0.75 8 0.10 -0.05 0.80 0.19 0.09 7.70 6.40 BASIC 4.50 Millimeters Minimum 24 1.20 0.15 1.05 0.30 0.20 7.90 Maximum
Reference Document: JEDEC Publication 95, MO-153
ICS843004AG-125 REVISION A JUNE 3, 2009
12
(c)2009 Integrated Device Technology, Inc.
ICS43004-125 Data Sheet
FEMTOCLOCKTM CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
TABLE 9. ORDERING INFORMATION
Part/Order Number 843004AG-125LF 843004AG-125LFT Marking ICS43004A125L ICS43004A125L Package 24 Lead "Lead-Free" TSSOP 24 Lead "Lead-Free" TSSOP Shipping Packaging tube 2500 tape & reel Temperature 0C to 70C 0C to 70C
NOTE: Par ts that are ordered with an "LF" suffix to the par t number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology, Incorporated (IDT) assumes no responsibility for either its use or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended termperature ranges, high reliability or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
ICS843004AG-125 REVISION A JUNE 3, 2009
13
(c)2009 Integrated Device Technology, Inc.
ICS43004-125 Data Sheet
FEMTOCLOCKTM CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
www.IDT.com
6024 Silver Creek Valley Road San Jose, CA 95138 Sales 800-345-7015 (inside USA) +408-284-8200 (outside USA) Fax: 408-284-2775 www.IDT.com/go/contactIDT Techical Support netcom@idt.com +480-763-2056
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT's sole discretion. All information in this document, including descriptions of product features and performace, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitablity of IDT's products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT's products are not intended for use in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT. Integrated Device Techology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third party owners. Copyright 2009. All rights reserved.


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